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Solvent-free film lamination adhesive
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Solvent-free film lamination adhesive

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Product description
Parameters

Type

Mix ratio

Application

DB-6691A/B

20 : 15

For general film lamination

DB-6692A/B

20 : 15

Used for cooking film compound

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Copyright Zhejiang Duobang New Material Co., Ltd. all rights reserved         www.300.cn